Microprocessor has become the heart of home/office PC systems. The microprocessor device require electrical energy for their work, the electrical energy is converted into heat energy this may affect the performance of a microprocessor. Heat sink was used to control the temperature of microprocessor in permissible limit. There are various parameters like heat sink material, fin thickness, number of fins, spacing between two fins, base plate thickness and fin shape etc. which affects the performance of heat sink. Material is one of the parameter that increase heat transfer rate. If copper is used in place of aluminium then heat transfer rate increases but at the same time cost also increases. The heat sink base plate thickness is parameter for improvement. When the base plate thickness was increased, the heat sink performed better. However, there are space limitations for every heat sink in a computer. Also the increase in number of fin was not a solution for improving heat transfer. So the fin shape is the parameter which has been studied in this work for better results.

Bachelor of engineering (Mechanical)Master of engineering (General mechanical)Currently working as a assistant professor in Dept. Of Mechanical Engineering.(R.C.Patel Institute of technology, Shirpur Maharashtra)Author has published four papers, Two conferences,Ten Workshops related to mechanical engineering.Total 5 years academic experience.